The Opportunity

NextZen AI is building Australia's first sovereign OSAT (Outsourced Semiconductor Assembly and Test) facility — the only advanced packaging operation in the country, and the first Five Eyes-aligned neutral OSAT in the world.

We are at ground floor. The GM of Packaging Operations is the founding technical leader of this facility. You will define the process architecture, recruit the engineering team, and stand up operations from greenfield. This role is a co-founder in everything but name.

What You Will Build

• Phase 1 FA lab: SEM, FIB, C-SAM, AXI — 72-hour failure analysis SLA, first paying customers
• NPI pilot line: flip-chip BGA, 2.5D packaging, chiplet assembly
• AUKUS-compliant secure bays with full chain-of-custody audit capability
• Copy-exact discipline and yield management framework from day one
• Phase 2 blueprint: Arizona/Texas facility replication

What We Need

• 15+ years in OSAT or IDM backend packaging operations — HVM environment essential
• Hands-on process knowledge: flip-chip, 2.5D/3D, HBM integration, FCBGA, underfill, molding
• Experience standing up or significantly scaling a packaging line
• FA process familiarity: SEM, FIB, C-SAM, AXI
• NPI discipline and copy-exact methodology
• People leadership — you will build and run the engineering team
• English proficiency required